| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_609c3d3510062e848aa4a78e7a4633cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0d350d6495cec5b7dd2bd795e8a0fc4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6677
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16267
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1412
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-157 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49833
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate |
2011-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10729bed28bc73968a84e3b16330afdd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9a483c9982793ef4f37374358a3fa72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7f877622d2e3cd246883b32f754e729 |
| publicationDate |
2014-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-102543927-B |
| titleOfInvention |
Packaging substrate having through-holed interposer embedded therein and fabrication method thereof |
| abstract |
The invention relates to a packaging substrate having through-holed interposer embedded therein and fabrication method thereof. The packaging substrate having a through-holed interposer embedded therein includes: a molding layer having opposite first and second surfaces; a through-holed interposer embedded in the molding layer and flush with the second surface; a redistribution-layer structure embedded in the molding layer and disposed on the through-holed interposer and having a plurality of electrode pads exposed from the first surface of the molding layer; and a built-up structure disposed on the second surface of the molding layer and electrically connected to the through-holed interposer. By embedding the through-holed interposer in the molding layer and forming the built-up structure on the second surface of the molding layer, the present invention eliminates the need of a core board and reduces the thickness of the overall structure. Further, since the through-holed interposer has a CIE close to or the same as that of a silicon wafer, the structural reliability during thermal cycle testing is improved. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10032702-B2 |
| priorityDate |
2010-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |