| abstract |
One disclosed embodiment comprises a substrate (820) having a top surface for receiving two or more semiconductor dies (810, 812). The disclosed embodiment further comprises a printed circuit board (898) attached to a bottom surface of the substrate and at least one via in the substrate. The at least one via (827) provides an electrical connection between a signal bond pad (826) of the semiconductor die and the printed circuit board. The at least one via provides an electrical connection between a first substrate bond pad and the printed circuit board. The first substrate bond pad is connected to the first signal bond pad of the first semiconductor die by a first signal bond wire (814). The at least one via also provides an electrical connection between the first signal bond pad of the first semiconductor die and a first land that is electrically connected to the printed circuit board (898). |