Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0222 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4605 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16237 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09336 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13116 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0251 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
filingDate |
2011-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2015-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2015-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-5732357-B2 |
titleOfInvention |
Wiring board and semiconductor package |
priorityDate |
2011-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |