patent/US-2019326228-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019326228-A1

Outgoing Links

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classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
filingDate	2019-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab52a986822b5fd1abeddec90238d226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da8e5f7279951e796b974189caeaa8a3
publicationDate	2019-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2019326228-A1
titleOfInvention	Interconnect Crack Arrestor Structure and Methods
abstract	A system and method for preventing cracks is provided. An embodiment comprises placing crack stoppers into a connection between a semiconductor die and a substrate. The crack stoppers may be in the shape of hollow or solid cylinders and may be placed so as to prevent any cracks from propagating through the crack stoppers.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10937735-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11749605-B2
priorityDate	2012-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID83648 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415777387

Total number of triples: 89.