| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3512
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05567
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3841 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate |
2013-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7cec2d3a249675009d79cceab3b5f3c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a417b0a23a62a068dbc40145266fda69
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_515388e5a72277b23093305e1509de47
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7eb213879a3d808876e13769e95d55d7 |
| publicationDate |
2014-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201436138-A |
| titleOfInvention |
Package structure and method of forming package structure |
| abstract |
The present disclosure provides a package structure and method comprising an integrated circuit chip electrically connected to a package substrate using a break-in metal wire through a conductive metal post. The package substrate has a metal pad relative to each embedded metal wire. The width of the metal pads is greater than the width of each corresponding embedded metal wire. The conductive metal post is electrically coupled to the embedded metal wire through the metal pad. The metal pads of the present disclosure overlap the intrusive metal wires in one direction. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10629561-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10256208-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I578466-B |
| priorityDate |
2013-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |