| abstract |
Significantly reduce the cost and improve the yield of narrowing the wiring pitch. During the manufacturing process of the multilayer wiring board formed from the multilayer wiring layer 3, it is mechanically constrained to the gas formed from the metal plate 16, and the top view of each layer during manufacturing is kept high along the top view of the metal plate l6, and the layers The occurrence of warpage in the structure is suppressed. It is more preferable that the base layer has bufferability. The multilayer wiring layer 3 with less distortion can be made thinner, and as a result, the wiring pitch can be shortened, and as a result, the manufacturing cost can be reduced. On the base layer formed from the plural metal layers 11 and the plural stress absorbing layers l2, the standoff height is increased and there is a buffer effect. |