| abstract |
An exemplary semiconductor package device includes a bare semiconductor chip, a packaged semiconductor chip adjacent to the bare semiconductor chip, and a rewiring structure bonded to the semiconductor chip packaged with the bare semiconductor chip. The rewiring structure includes: a first rewiring layer having a first thickness; A second rewiring layer having a second thickness; And a third rewiring layer between the first rewiring layer and the second rewiring layer. The third rewiring layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the wiring structure, and a molding compound that encapsulates the bare semiconductor chip, the packaged semiconductor chip, and the underfill. |