patent/US-2017084544-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017084544-A1

Outgoing Links

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filingDate	2015-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55f458d34199152a5f7337399f9f5b0e
publicationDate	2017-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2017084544-A1
titleOfInvention	Integrated Circuit Dies Having Alignment Marks and Methods of Forming Same
abstract	Dies having alignment marks and methods of forming the same are provided. A method includes forming a device on a substrate. A plurality of contact pads is formed over the substrate and the device. Simultaneously with forming the plurality of contact pads, one or more alignment marks are formed over the substrate and the device.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I785278-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11315858-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020103025-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11289422-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11018030-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10553489-B2
priorityDate	2015-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425270609

Total number of triples: 104.