patent/US-10886149-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10886149-B2

Outgoing Links

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filingDate	2019-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2021-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3e0c4a3d7450e110645a4800d34c22b
publicationDate	2021-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-10886149-B2
titleOfInvention	Semiconductor device package and method of manufacturing the same
abstract	A semiconductor device package includes a substrate, a semiconductor device, and an underfill. The semiconductor device is disposed on the substrate. The semiconductor device includes a first lateral surface. The underfill is disposed between the substrate and the semiconductor device. The underfill includes a first lateral surface. The first lateral surface of the underfill and the first lateral surface of the semiconductor device are substantially coplanar.
priorityDate	2019-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID101939 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419517753 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452992500 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3024 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419517752 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6346

Total number of triples: 81.