patent/DE-112019000113-T5

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112019000113-T5

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filingDate	2019-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65f5d34063ca9f867d9ae47ed526f216 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61d17386b23d6242a5307c533b6d8b3a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f624b63bd05a5990d6acb6c9487c8cf3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3bf8bb75ac279ac547d19cbef9ce0a51 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44eb68b85609597cb3ac94097b44b6e8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b71aa782fbecb32f4ae87f1b7f14856 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a96bb916ecbf08b618d18b04fa336cc0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78c865c9db3a87179b8b27edc3d342bd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11f5b566ae25925f6599fac8a2575a0f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2312764207a90f7f227bda893e69d103
publicationDate	2020-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	DE-112019000113-T5
titleOfInvention	SEMICONDUCTOR COMPONENT WITH A DISTRIBUTED MEMORY CHIP MODULE
abstract	A semiconductor device is disclosed that includes one or more integrated memory modules. Each integrated memory module can include a pair of semiconductor chips that work together as a single integrated memory. In one example, the first chip may be the memory cell array and the second chip may be the logic circuit, such as. B. integrated CMOS circuits included. In one example, the first chip can be bonded to the second chip using flip-chip technology.
priorityDate	2018-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541

Total number of triples: 114.