| abstract |
The present invention relates to a method of manufacturing a semiconductor device, comprising the steps of: preparing a layered body in which at least a temporary fixing sheet and a wiring sheet on which a rewiring layer is formed; and step B: a wiring sheet on the laminated body Fusing a wafer to mount a semiconductor wafer; Step C: preparing a sheet for sealing, which is obtained by replasticizing a kneaded material obtained by kneading an epoxy resin, a hardener, and an inorganic filler; Step D: in a semiconductor A sealing sheet is placed on the surface on the exposed side of the wafer, the semiconductor wafer is filled in the sealing sheet, Step E: The sealing sheet is thermally cured, and Step F: The temporary fixing sheet is peeled off from the wiring sheet. |