| abstract |
Step A of preparing a first laminate having an inorganic substrate, a resin layer, and a plurality of devices mounted at intervals on the resin layer in this order; a step B of forming an elastomer layer so as to cover the second laminate to obtain a second laminate, and a step C of peeling the inorganic substrate, wherein a plurality of resin layers are formed in advance at at least at positions corresponding to a plurality of devices, or The manufacturing method of the device connection body which is formed as a some resin layer in the position corresponding to at least a some device by removing a part of resin layer after the process C of peeling an inorganic substrate. |