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Object |
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c1e49aee5e8b4d0893942406354c171 |
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| classificationCPCInventive |
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-96
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| classificationIPCInventive |
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| filingDate |
2014-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_591bfe9f2c12cd53003e6634203e6ef1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b151b58d57e551c8f6e8da42a8336392
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2daf80ce63b559d591028cc48a18f59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac71dd8730a9b703d7ad689eeadd51de |
| publicationDate |
2014-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014239495-A1 |
| titleOfInvention |
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP |
| abstract |
A semiconductor device is made by forming a first conductive layer over a carrier. The first conductive layer has a first area electrically isolated from a second area of the first conductive layer. A conductive pillar is formed over the first area of the first conductive layer. A semiconductor die or component is mounted to the second area of the first conductive layer. A first encapsulant is deposited over the semiconductor die and around the conductive pillar. A first interconnect structure is formed over the first encapsulant. The first interconnect structure is electrically connected to the conductive pillar. The carrier is removed. A portion of the first conductive layer is removed. The remaining portion of the first conductive layer includes an interconnect line and UBM pad. A second interconnect structure is formed over a remaining portion of the first conductive layer is removed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021358768-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11699597-B2 |
| priorityDate |
2008-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |