| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D303-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2013-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72f4912ccaae2639c99fcffa12800a6c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84d1acb41b9347a64bb6b69ade65bcb0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43865c420f84df6cbbea8f7b0d053979
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48b03303a847852712431db578a948b1 |
| publicationDate |
2014-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2014239154-A |
| titleOfInvention |
Manufacturing method of semiconductor device |
| abstract |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of suppressing a connection failure between a wiring sheet and a semiconductor chip and improving adhesion between a sealing sheet and a wiring sheet. A process A for preparing a laminate in which at least a temporary fixing sheet and a wiring sheet on which a rewiring layer is formed are laminated; a process B for flip-chip mounting a semiconductor chip on the wiring sheet of the laminate; Step C for preparing a sealing sheet obtained by plastic processing a kneaded product obtained by kneading an epoxy resin, a curing agent, and an inorganic filler, on the surface on which the semiconductor chip is exposed A semiconductor device comprising a step D for disposing a sealing sheet and embedding a semiconductor chip in the sealing sheet, a step E for thermosetting the sealing sheet, and a step F for peeling the temporary fixing sheet from the wiring sheet Manufacturing method. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018065953-A |
| priorityDate |
2013-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |