| abstract |
A semiconductor module component encapsulated with a liquid encapsulating resin composition is provided with a thinner semiconductor module component with less warping during mounting. In a semiconductor module component in which a semiconductor chip and / or a passive element is mounted on a module circuit board composed of a core substrate including a core material and sealed with a resin composition, the resin composition comprises ( A liquid resin composition comprising, as essential components, A) an epoxy resin, (B) an inorganic filler, (C) a curing accelerator, and (D) a silane compound having a secondary amino group or a tertiary amino group, the liquid resin The elastic modulus at 250 ° C. of the cured product of the composition is 1 to 15 GPa, the thermal expansion coefficient from 25 ° C. to 260 ° C. is 2500 to 4500 ppm, and the height of the semiconductor module component is 1.6 mm or less. Semiconductor module parts. [Selection] Figure 1 |