| abstract |
A die-bonding method comprises steps of providing a target substrate which has a supporting base, and a circuit structure formed on one side of the supporting base, wherein the circuit structure has a glass plate formed on the supporting base, a transparent conductive layer formed on the glass plate, a metal layer formed on the transparent conductive layer, at least one bonding-reinforced circuit layer formed on the metal layer, and multiple electrical contacts formed on the bonding-reinforced circuit layer; providing multiple semiconductor elements attached to a carrier plate and spaced apart from each other by gaps, wherein each semiconductor element has a pair of electrodes aligned with two corresponding electrical contacts of the circuit structure of the target substrate; and providing a beam generator generating at least one energy beam for joining and electrically connecting the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. |