| abstract |
A method of bonding a matrix of light emitting devices onto a substrate includes forming a conductive material on bond pads of the substrate in a matrix arrangement. Individually, a plurality of light emitting elements are also picked up and placed on a temporary carrier in the matrix arrangement. A transient carrier comprising a plurality of light emitting elements is then held by the bond head and moved by the bond head to establish contact between the electrodes on the plurality of light emitting elements and the conductive material on the substrate. When heat is applied to the light emitting elements while applying a compressive force to the conductive material by the bond head, conductive junctions are formed between the light emitting elements and the substrate. |