| abstract |
Some novel features include a base portion for an integrated device, a first die (eg, a first wafer level die), and a second die (eg, a second wafer level die). It belongs to an integrated device (eg integrated package). The base portion includes a first inorganic dielectric layer, a first set of interconnects disposed within the first inorganic dielectric layer, and a second dielectric layer that is different from the first inorganic dielectric layer; , And a set of redistribution metal layers in the second dielectric layer. The first die is bonded to the first surface of the base portion. The second die is coupled to the first surface of the babe portion, and the second die is electrically coupled to the first die via the first set of interconnects. |