| abstract |
A connection structure obtained by anisotropically conductively connecting a terminal of a flexible substrate and a terminal of a rigid substrate using an anisotropic conductive adhesive film so that the indentation of the terminal can be observed from the flexible substrate side, Moreover, the connection resistance should not be increased under the heat and humidity test. In an anisotropic conductive adhesive film for anisotropic conductive connection between a terminal of a flexible substrate and a terminal of a rigid substrate, the particle diameter of the conductive particles after the anisotropic conductive connection is A, and the flexible conductive adhesive film is flexible. When the gap between the terminal of the substrate and the terminal of the rigid substrate is B, the indentation rate defined by 100 · (A−B) / A is 40% or more as the conductive particles so as to be 4 μm or more. A particle having a particle diameter and a compression hardness of 4500 kgf / mm 2 or more is used. Moreover, when the maximum diameter of the conductive particles is a and the minimum diameter is b, the sphericity of the conductive particles represented by a / b is 5 or less. [Selection] Figure 1 |