| abstract |
【Task】 An object of the present invention is to provide a method for manufacturing an electronic component in which the chip holding property, pick-up property, and contamination prevention property of a semiconductor chip are improved in a well-balanced manner. [Solution] The present invention includes an adhesive forming step of forming an adhesive semi-cured layer on the back surface of the wafer, an adhesive step of attaching and fixing an adhesive sheet to the adhesive semi-cured layer of the wafer and the ring frame, and the wafer to a semiconductor chip. An electronic component manufacturing method including a dicing step for dividing, an ultraviolet ray irradiation step for irradiating ultraviolet rays, and a pickup step for picking up a chip and an adhesive semi-cured layer from an adhesive layer. [Selection figure] None |