Photosensitive adhesive, and the adhesive film obtained by using this, the adhesive sheet, the semiconductor wafer with an adhesive bond layer, a semiconductor device, and electronic components
The photosensitive adhesive composition containing (A) polyimide which has a carboxyl group as a side chain, acid number is 80-180 mg / KOH, (B) radiation polymeric compound, and (C) photoinitiator.