| abstract |
For example, it is preferably used as a conductive bonding material when bonding a semiconductor chip (especially a power device) on an element carrying portion of a lead frame or on a circuit electrode portion of an insulating substrate, and has particularly excellent conductivity while achieving lead-free. , A conductive adhesive film capable of forming a bonding layer having excellent both heat resistance and mounting reliability after bonding and sintering, on an element carrying portion of a semiconductor chip and a lead frame, or between a circuit electrode portion of an insulating substrate, and a dicing die using the same To provide a bonding film. The conductive adhesive film of the present invention contains metal particles (Q), a resin (M), and a predetermined organophosphorus compound (A), and the resin (M) contains a thermosetting resin (M1), The metal particles Q contain 10% by mass or more of the first metal particles Q1 having an average particle diameter d50 of 20 µm or less and a fractal dimension of 1.1 or more as viewed from a perspective view in a primary particle state. |