| abstract |
It is a backgrinding tape used for a backgrinding process performed after dicing, and provides a backgrinding tape which prevents chip fall that may occur during backgrinding. The backgrinding tape of this invention is equipped with an adhesive layer, an intermediate | middle layer, and a 1st base material in this order, The material which comprises the said intermediate | middle layer is acrylic resin which has a carboxyl group and is not crosslinked, The said adhesive layer The initial adhesive force at the time of adhering to a Si mirror wafer is 1N / 20mm-30N / 20mm. |