abstract |
A method of manufacturing an electronic component having improved balance between chip support, pick-up property and contamination prevention of a semiconductor chip, comprising: an adhesive forming process for forming an adhesive semi-hardened layer on the back surface of a wafer, and adhesion to the adhesive semi-hardened layer and a ring frame of a wafer An adhesive sheet includes an attaching step of attaching and fixing a sheet, a dicing step of dividing a wafer into semiconductor chips, an ultraviolet irradiation step of irradiating ultraviolet rays, and a pickup step of picking up a chip and an adhesive semi-cured layer from the adhesive layer. It provides the method of using what provided the adhesion layer with the adhesive which has a predetermined | prescribed composition in the. |