| abstract |
Provided is a semiconductor mounting adhesive capable of controlling a gap with high accuracy and increasing heat resistance when mounting a semiconductor. The adhesive for semiconductor mounting according to the present invention is an adhesive used for mounting a semiconductor, which comprises a silicone resin and a spacer, wherein the content of the spacer is 0.1 wt% or more and 5 wt% or less in 100 wt% and a 10% compression modulus of elasticity of the spacer 5000N / mm 2 or more 15000N / mm 2 or less, and the mean particle size of the spacer over 10㎛ 200㎛ below. |