| abstract |
The present invention provides a bonding film and wafer processing tape capable of improving mechanical strength and thermal cycle characteristics in a semiconductor device in which a semiconductor element and a substrate are bonded. A bonding film 13 for bonding a semiconductor element 2 and a substrate 40, wherein a conductive paste containing metal fine particles (P) is filled in pores or meshes of a reinforcing layer made of a porous body or a network. It has the characteristic that it has the adhesive bonding layer 13a. |