abstract |
The present invention comprises a conductive layer containing at least one selected from the group consisting of copper, nickel, cobalt, iron, stainless steel (SUS) and aluminum, and having a thickness of 0.05 μm or more; And an adhesive layer formed on at least one surface of the conductive layer, the adhesive layer comprising a (meth) acrylate-based resin, a curing agent, and an epoxy resin. |