http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005161774-A1

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2848
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-22
filingDate 2003-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13bf81401cf0426816f03d7464f7e7a8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9db55764c6255d1a6413c62779d67ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16b037f8d560c4e3c4ff6354f6a62440
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0c96f62dcca6474629f3a55f404a44a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8216e68c55b2a2c7b494631601ae2783
publicationDate 2005-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2005161774-A1
titleOfInvention Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film
abstract The present invention relates to a surface protecting adhesive film for a semiconductor wafer in which an adhesive layer having a storage elastic modulus from 1×10 5 Pa to 1×10 7 Pa at 150° C, and a thickness of from 3 μm to 100 μm is formed on both a surface and back surface of a base film having a melting point of at least 200° C. and a thickness of 10 μm to 200 μm. According to the present invention, in a step of grinding the back side of a semiconductor wafer and removing a damaged layer generated on the back side, the semiconductor wafer can be prevented from being broken and being contaminated and the like even if a semiconductor wafer is thinned as low as 100 μm.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006166462-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011008949-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016103262-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007059903-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9244204-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9563004-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7479455-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011110094-A1
priorityDate 2002-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6398892-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6114753-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5753362-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6730595-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2001014492-A1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226405542
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID127531426
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21917816
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128354642
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID127820794
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226405545
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226411174
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7836
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129321502
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226423510
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID13360
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID127505523
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226417651
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226528974
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID350453
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7636
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7187
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21872322
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226405418
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID75118
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226405414
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID77921
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7274
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226414064
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226414065
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID19601
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226405430
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128364723
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8033
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID13835
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID127841703
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7343
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226410229
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129940487
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID18938679
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226405537
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226405541
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129386610
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128284852
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8040
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226421527
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID92667
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID28594
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226412561
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID25320
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226650376
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7354
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226409069
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128434683
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21863597
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID127466300
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226393282
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226422483
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21983012
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226393280
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12979
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129469394
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128865960
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID874
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226407772
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226393257
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226414190
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID93079
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226409896
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129071671
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID13192
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID54286124
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID66583660
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226423124
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21585042
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128084881
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129182564
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226422091
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226405948
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6547
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID92938
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129279105
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7837
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129163724
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21220
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226405436
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10130166
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8846

Total number of triples: 122.