| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2400-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2483-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-14 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-5022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B43-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-5013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate |
2015-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2019-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-106574163-B |
| titleOfInvention |
Adhesive for temporary bonding, adhesive layer, wafer processed body, method for manufacturing semiconductor device using the same, polyimide copolymer, polyimide mixed resin, and resin composition |
| abstract |
The present invention provides an adhesive for temporary bonding and a method for manufacturing a semiconductor device using the same. The adhesive for temporary bonding is excellent in heat resistance and can bond a semiconductor circuit forming substrate and a semiconductor circuit forming substrate with one adhesive layer. The bonding of the supporting substrate does not change the adhesive strength even through the manufacturing process of semiconductor devices and the like, and can be peeled off under mild conditions at room temperature thereafter. The present invention is an adhesive for temporary bonding, which is characterized in that it is a polyimide copolymer having at least an acid dianhydride residue and a diamine residue. (A1) a polysiloxane-based diamine residue represented by the general formula (1) and n being a natural number of 1 to 15, and (B1) a residue represented by the general formula (1) and n being 16 Both of the residues of polysiloxane-based diamines of natural numbers of 100 or less, the polyimide copolymer contains 40 to 99.99 mol% of residues of (A1), and 0.01 to 60 mol% of ( B1) residues. |
| priorityDate |
2014-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |