http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106206394-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68377 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68354 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J113-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49586 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-185 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate | 2016-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106206394-B |
| titleOfInvention | Adhesive sheet, dicing tape-integrated adhesive sheet, film, method for manufacturing semiconductor device, and semiconductor device |
| abstract | The invention relates to an adhesive sheet, a dicing tape-integrated adhesive sheet, a film, a method for manufacturing a semiconductor device, and a semiconductor device. The invention aims to provide an adhesive sheet which can effectively release heat generated at a chip to a lead frame. The present invention also provides a dicing tape-integrated adhesive sheet, a film, and the like including the adhesive sheet. The present invention relates to an adhesive sheet. When a device having a lead frame, an adhesive layer disposed on the lead frame, and a silicon chip disposed on the adhesive layer is formed using the adhesive sheet of the present invention, the interface thermal resistance between the adhesive layer and the lead frame is 0.15K/W or less, and the total thermal resistance is 0.55K/W or less. The total thermal resistance is the sum of the interfacial thermal resistance and the internal thermal resistance of the adhesive layer. |
| priorityDate | 2015-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 192.