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filingDate 2012-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f67f28c61a5c2c85f21db120087a34db
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53eb2873670e8dffa2dca018d00a3fd4
publicationDate 2014-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20140104013-A
titleOfInvention Adhesive agent, and method for connecting electronic component
abstract The present invention provides an adhesive capable of achieving good conduction with respect to a pre-flux treated substrate, and a method of connecting electronic components. (Meth) acrylate having an epoxy group in one molecule and a radical polymerization initiator having a half-life temperature of 110 DEG C or more for one minute are used. The imidazole component in the pre-flux bonded with the epoxy group of the epoxy group-containing acrylate is removed from the terminal surface in such a manner as to be taken out by the flow of the excess adhesive component between the terminals.
priorityDate 2011-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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