Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_07df74462e6193cbf71c250f0d4590e7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0221 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-325 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-361 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-361 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-10 |
filingDate |
2012-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f67f28c61a5c2c85f21db120087a34db http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53eb2873670e8dffa2dca018d00a3fd4 |
publicationDate |
2014-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20140104013-A |
titleOfInvention |
Adhesive agent, and method for connecting electronic component |
abstract |
The present invention provides an adhesive capable of achieving good conduction with respect to a pre-flux treated substrate, and a method of connecting electronic components. (Meth) acrylate having an epoxy group in one molecule and a radical polymerization initiator having a half-life temperature of 110 DEG C or more for one minute are used. The imidazole component in the pre-flux bonded with the epoxy group of the epoxy group-containing acrylate is removed from the terminal surface in such a manner as to be taken out by the flow of the excess adhesive component between the terminals. |
priorityDate |
2011-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |