http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100945635-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2463-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2421-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J121-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate | 2007-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100945635-B1 |
| titleOfInvention | Adhesive film composition for semiconductor assembly, adhesive film by this, and dicing die-bonding film containing same |
| abstract | The present invention relates to an adhesive film composition for semiconductor assembly, an adhesive film and a dicing die-bonding film comprising the same, wherein the composition according to the present invention contains a modified silicone oil, a thermoplastic resin, a filler, a hydroxyl group, a carboxyl group or an epoxy group. Elastomer resin, epoxy resin, phenol-type epoxy resin curing agent, phosphine-based, boron-based, imidazole-based curing catalysts and at least one selected from the group consisting of a silane coupling agent, in particular, the addition process by adding a modified silicone oil It is possible to provide an adhesive film for semiconductor assembly which can secure excellent processability and reliability since the pick-up success rate of the chip is increased during the manufacturing process by preventing fixation between films generated at the time and lowering the peel strength with the adhesive film.n n n Adhesive film for semiconductor assembly, peel strength, fixation, technical, modified silicone oil, phenolic curing agent, epoxy resin |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015088282-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9540547-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101730054-B1 |
| priorityDate | 2007-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 85.