| abstract |
Provided is an adhesive composition that can prevent electrical shorts and metal corrosion in semiconductor packages. The adhesive composition of the present invention has 5 to 30 parts by weight of ion trapping based on 100 parts by weight of the base resin consisting of 30 to 70% by weight of general purpose liquid and solid epoxy, 7 to 20% by weight of inorganic filler, and 15 to 50% by weight of rubber. And 5 to 20 parts by weight of latent curing agent and 0.1 to 1 part by weight of curing accelerator and / or solvent. The solvent is preferably about 30 to 40% of the total weight of the composition. In this case, the ion trapping agent may be selected from the group consisting of zirconium oxide, oxide of antimony, oxide of bismuth, magnesium oxide, aluminum oxide and mixtures thereof. |