| abstract |
An object of the present invention is to provide excellent storage stability in various environments, prevent contamination of an adherend even after use, and provide a circuit pattern when bonded to a circuit pattern forming surface of a semiconductor wafer. Provided is a pressure-sensitive adhesive sheet for processing semiconductor wafers, which has excellent followability to a step to be formed and has excellent floating amount stability over time. An adhesive layer is provided on at least one surface of a base material, and the adhesive layer has a base polymer added with a polyester-based plasticizer and a surfactant, and the solubility parameter of the plasticizer and the surfactant ( (SP value) satisfies the relationship of 0.9 ≦ [SP value of plasticizer] / [SP value of surfactant] ≦ 1.0. [Selection figure] None |