| abstract |
The present invention relates to a wafer-processed product in which a temporary adhesive layer is formed on a support, and a wafer having a circuit surface on its surface and a back surface to be processed is laminated on the adhesive layer, A first adhesive layer made of a thermoplastic organopolysiloxane polymer layer (A) peelably adhered to the surface of the wafer, and a second adhesive layer made of a thermosetting siloxane modified polymer layer (B) peelably laminated on the first adhesive layer A third adhesive layer made of a thermosetting siloxane polymer layer (C) which is peelably laminated on the adhesive layer and peelably adhered to the support, and a second adhesive layer It is a processed body. Thus, there is provided a wafer-processed product which can easily peel off and peel off, and can easily peel off the thin wafer prior to peeling, and can improve the productivity of the wafer and the productivity of the thin wafer. |