| abstract |
[Problem] To provide a sheet having excellent bondability, which is capable of imparting a semiconductor device that is obtained using the sheet with heat dissipation characteristics without having a semiconductor wafer or chip subjected to a special process in the production procedure of the semiconductor device, said special process causing increase of steps and complication of the procedure. [Solution] A sheet for forming a resin film for chips according to the present invention comprises a supporting sheet and a resin film-forming layer that is formed on the supporting sheet. The resin film-forming layer contains (A) a binder polymer component, (B) a curable component, (C) an inorganic filler and (D) a silane coupling agent. The inorganic filler (C) contains nitride particles (C1), and the silane coupling agent (D) has a molecular weight of 300 or more. |