| abstract |
The present invention provides an adhesive tape for semiconductor processing capable of suppressing chip cracks even when used for DBG, particularly LDBG. The adhesive tape for semiconductor processing has: a substrate having a Young's modulus of 1000 MPa or more at 23° C.; a buffer layer provided on at least one side of the substrate; and an adhesive provided on the other side of the substrate agent layer, the tensile storage modulus (E 23 ) of the buffer layer at 23°C is 100-2000MPa, and the tensile storage modulus (E 60 ) of the buffer layer at 60°C is 20-1000MPa . |