| abstract |
For example, a semiconductor chip (particularly, a power device) is preferably used as a conductive bonding material when bonding the element supporting portion of the lead frame or the circuit electrode portion of the insulating substrate, and achieving lead-free, A conductive adhesive film capable of forming a bonding layer excellent in both heat resistance after soldering and sintering and reliability in mounting between the semiconductor chip and the element supporting portion of the lead frame or between the circuit electrode portion of the insulating substrate and a dicing die Providing a bonding film. The conductive adhesive film of the present invention comprises metal particles (P), a resin (M) and a predetermined sulfide compound (A), wherein the resin (M) comprises a thermosetting resin (M1) The particles P contain at least 10 mass% of the first metal particles P1 having an average particle diameter d50 of 20 m or less and a fractal dimension of 1.1 or more as viewed from a projection view in a primary particle state. |