| abstract |
An object of the present invention is to suppress a reaction between an activator and solder powder in a solder flux, thereby suppressing an increase in viscosity when the solder paste is stored, and deterioration of meltability after the solder paste is stored. Further, the present invention provides a solder powder and a solder paste using the powder, which can suppress an increase in viscosity during handling during printing using a printing machine. The surface of a solder powder composed mainly of Sn has a compound having both a thiol group and a carboxyl group in its structure, a triazine compound represented by the following structural formula (1), and the following structural formula: It is characterized by being surface-treated with a sulfide compound represented by (2) or a disulfide compound represented by the following structural formula (3). [Selection] Figure 3 |