| abstract |
Provided is an adhesive composition for infrared peeling, which can be peeled by irradiation with infrared light, comprising: a component (A) which is cured by a hydrosilylation reaction; and at least one type of component (B) selected from the group consisting of a component containing epoxy-denatured polyorganosiloxane, a component containing a methyl group-containing polyorganosiloxane and a component containing a phenyl group-containing polyorganosiloxane. |