| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8205ec6ee1cd95eb60a03826535bad97 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2037-1253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2309-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B38-0036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2038-0076 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-401 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate |
2019-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b946eab539dd527dc8c7219008be788c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07027eb66f1cfd818ee6c04f1a83c8aa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a1e52ebb547388b1fb39a53f807427f |
| publicationDate |
2022-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2022025236-A1 |
| titleOfInvention |
Adhesive agent composition, layered product and production method for layered product, and method for reducing thickness of semiconductor forming substrate |
| abstract |
An adhesive composition for forming an adhesive layer that can bond a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate in a peelable manner, the composition containing a component (A) which is cured through hydrosilylation and a peeling component (B) which contains a component containing an epoxy-modified polyorganosiloxane, wherein the component (A) contains a polysiloxane (A1) including a siloxane unit represented by SiO 2 (unit Q) and the like, and a platinum group metal catalyst (A2); and the polysiloxane (A1) contains a polyorganosiloxane (a1) including a siloxane unit represented by SiO 2 (unit Q′) and the like, and a polyorganosiloxane (a2) including a siloxane unit represented by SiO 2 (unit Q″) and the like, and having a functional group (Si—H) content of 5.0 mol/kg or greater. |
| priorityDate |
2018-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |