abstract |
Provided is a thermal bonding sheet which suppresses a compositional material of the thermal bonding sheet from protruding during bonding and from creeping up onto the surface of an object to be bonded, and provides a strong sintered layer after sintering. n A thermal bonding sheet includes a layer. When the layer is analyzed by a differential thermal balance from 23°C to 500°C in an air atmosphere at a heating rate of 10°C/min, a value obtained by subtracting a weight decrease amount (%) at 300°C from a weight decrease amount (%)at 500°C is in a range of -1% to 0%. |