| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate |
2022-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_472c2eacceb0f4a82df9dbd447c56452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b9418afe930bf61e204bdf87ff879ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e3faccd362d1d16b9a2934a9d33400c |
| publicationDate |
2022-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2022186095-A1 |
| titleOfInvention |
Transparent adhesive composition, film-shaped transparent adhesive, method of producing transparent adhesive cured layer-attached member, and electronic component and method of producing the same |
| abstract |
A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2):(1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% cumulative distribution frequency of 2.0 μm or less; and(2) the epoxy resin-curing agent (B) has solubility in 100 g of methyl ethyl ketone at 25° C. of 0.1 g or less;a film-shaped transparent adhesive processed therefrom;a method of producing a transparent adhesive cured layer-attached member by using the film-shaped transparent adhesive;a method of producing an electronic component; andan electronic component. |
| priorityDate |
2020-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |