| abstract |
The present invention relates to a controller die-embedded type adhesive film applied to a semiconductor package of a film on die (FOD) type and a semiconductor package using the same. More specifically, the present invention embeds the controller die effectively to suppress voids To a controller die-embedded type adhesive film capable of improving reliability and minimizing the amount of an adhesive layer flowing out to the outside, thereby facilitating wire bonding without contamination of the adhesive layer, and a semiconductor package using the same. |