| abstract |
Provided is a resin composition that is suitable as a one-component adhesive to be used during production of image sensor modules and electronic components due to being heat-curable at a temperature of approximately 80ºC and having exceptional PCT resistance. This resin composition is characterized by containing (A) an epoxy resin, (B) a compound shown by formula (1), (C) a curing accelerator, and (D) a silane coupling agent, the contained amount of the compound of component (B) being from 1:0.5 to 1:2.5 by equivalent ratio of epoxy groups in the epoxy resin of component (A) and thiol groups in the compound of component (B), the contained amount of the silane coupling agent of component (D) being from 0.2 to 50 parts by mass per 100 total parts by mass of component (A), component (B), component (C), and component (D), and the equivalent ratio of thiol groups in the compound of component (B) and Si in the silane coupling agent (D) being from 1:0.002 to 1:1. |