| abstract |
Provided is a photosetting and thermosetting resin composition that suppresses decrease of adhesion strength in a moisture resistance test on the cured resin composition, and that has a sufficiently long pot life. The resin composition is characterized by containing (A) an acrylic resin, (B) a multifunctional nitrogen-containing heterocyclic compound represented by a specific chemical formula, (C) a latent curing agent, (D) a radial polymerization inhibitor, and (E) an anionic polymerization inhibitor. The resin composition preferably further contains (F) a compound other than acrylic resins with a glycidyl group. |