| abstract |
The present invention provides a resin composition for bonding a semiconductor having a low water absorption rate, a good adhesive strength during heat and a good adhesive strength after heat absorption and a semiconductor device excellent in solder reflow resistance. A thermosetting resin composition for semiconductor adhesion, comprising (A) a thermosetting resin, (B) an inorganic filler, and (C) a silane coupling agent containing an epoxy group as essential components. And (C) a silane coupling agent containing an epoxy group is a compound represented by the following general formula (1): [Chemical 1] (In the formula, R and R ′ are each independently an alkyl group having 1 to 4 carbon atoms, A is a divalent organic group having 5 to 12 carbon atoms which may sandwich an oxygen atom, and n is 1 It is an integer of ~ 3.) [Selection figure] None |