| abstract |
PROBLEM TO BE SOLVED: To reduce tact time when a die bonding material is applied onto a semiconductor support member by a printing method to join a semiconductor chip, and there is an assembly failure due to insufficient curing or excessive curing in the B stage. To provide a method for manufacturing a semiconductor device, which can be sufficiently prevented and can manufacture a semiconductor device having excellent reliability with high productivity. A method of manufacturing a semiconductor device according to the present invention includes a photocurable component and a thermosetting component on a semiconductor support member 10 for mounting a semiconductor chip, and a solvent content is 5% by mass or less. A first step of applying a resin paste for die bonding by a printing method to provide a coating film 30 of the resin paste, a second step of photocuring a photocurable component by irradiating the coating film 30 with light, and a semiconductor support member 10 And a third step of bonding the semiconductor chip 50 to each other with the light-irradiated coating film 32 sandwiched therebetween. [Selection] Figure 1 |