| abstract |
An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having a reactive double bond group, and a filler (C) having a reactive double bond group on a surface thereof. The acrylic polymer (A) has a weight average molecular weight of 500,000 or more, and the heat curable resin (B) comprises an epoxy resin and a heat curing agent, in which at least one of the epoxy resin and the heat curing agent has the reactive double bond group. |