| abstract |
[Problem] It has hot-melt property, adheres strongly to non-adhesive substrates, and is particularly excellent in flexibility and toughness at high temperatures from room temperature to 150° C. of hardened products such as over-molding molding, and even when integrally molded with a lead frame, Provided are a curable silicone composition and the like that provide a cured product that is less likely to break. [Solutions] (A) Organopolysiloxane resin microparticles containing at least 20 mol% or more of the siloxane units represented by RSiO 3/2 (wherein R is a monovalent hydrocarbon group) of the total siloxane units, (B) silatran It consists of at least one adhesion-imparting agent selected from derivatives and carbasilatran derivatives, (C) a curing agent, and (D) a functional inorganic filler, wherein the content of component (D) is at least 50% by volume or more with respect to the entire composition; , A curable silicone composition and its use, characterized in that it is solid at 25° C. and has hot-melt properties at a temperature of 200° C. or less. |